By Bao Yang; Peng Wang; World Scientific (Firm)
The 1st set of the Encyclopedia, Thermal Packaging thoughts, makes a speciality of the know-how ''building blocks'' used to gather an entire thermal administration procedure and supply unique descriptions of the underlying phenomena, modeling equations, and correlations, in addition to information for attaining the optimum designs of person ''building blocks'' and their insertion within the total thermal answer. particular volumes care for microchannel coolers, chilly plates, immersion cooling modules, thermoelectric microcoolers, and cooling units for stable country lights structures, in addition to innovations and methods for the experimental characterization of thermal administration elements. those ''building blocks'' are the basic components within the construction of a whole, competitively priced thermal administration method. The 4 units within the Encyclopedia of Thermal Packaging will give you the amateur and scholar with a whole reference for a fast ascent at the thermal packaging ''learning curve'', the practitioner with a proven set of strategies and instruments to stand each problem, and researchers with a transparent definition of the state of the art and rising must advisor their destiny efforts. This encyclopedia will, hence, be of significant curiosity to packaging engineers, digital product improvement engineers, and product managers, in addition to to researchers in thermal administration of digital and photonic elements and platforms, and most dear to undergraduate and graduate scholars learning mechanical, electric, and digital engineering. Read more...
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Extra resources for Encyclopedia of thermal packaging. : Volume 4, Thermoelectric microcoolers thermal packaging techniques
Similar behavior was observed for all channel dimensions in the range 324 µm < Dh < 974 µm. It may also be noted that the experimental friction factors start to deviate from the laminar predictions at Re ≈ 2000, indicating the onset of transition. This again indicates that the hydrodynamic behavior of the microchannels is not different from that of conventional channels in terms of flow transition. 30 Microchannel Heat Sinks for Electronics Cooling (a) (b) Fig. 7. 34 For cases where pressure taps are placed in the inlet and outlet manifolds, outside the length of the microchannels, measured measured pressure drop values include pressure losses due to the sudden contraction at the inlet and the expansion at the Design and Optimization of Single-Phase Microchannel Heat Sinks 31 outlet of the channels, as well as friction losses in the inlet and outlet manifolds and microchannels.
When z* < zth* . Beyond zth* , the flow can be assumed to be fully developed, and Eq. 24) should be used instead. 391 × 10−1 . 29) Predictions from these correlations compare very favorably with previous computational28,31 and experimental32 results for conventional channels, as well as with experimental results for microchannel heat sinks4 as demonstrated in Ref. 30. It should be noted, however, that three-sided heating is common in electronics cooling applications, in which case, the following correction factor proposed by Philips27 should be used to calculate Nuz ,3 : 28 Microchannel Heat Sinks for Electronics Cooling Nuz ,3 = Nuz × ( Nu fd ,3 / Nu fd ).
As depicted in Fig. 12(a), a recirculation region is identified in the inlet manifold with the 42 Microchannel Heat Sinks for Electronics Cooling Lateral Position, y (µm) original design used in the experiments, which constricts the available space for flow distribution and results in higher localized velocities and higher pressure drops. At the heat sink centerline, the flow has a more direct path through the manifold, leading to higher mass fluxes in the center channels. 5 1 Velocity (m/s) (b) Re =102 Fig.